Double Side and Multi-layer PCB Board

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Products	Features	Monthly   Capacity	Applications	Remarks
Double   Side   PCB	- HASL - PTH - Cu (Pre Flux    Coating) - Au - Carbon	6,000 §³	Car Audio, Cordless Phone CD-Rom Drive, Car-CD, Workmen, L.C.D., Fax, Map, Video Camera,  Handy Phone, Tuner Board, Power Supply, R.F. Board,	Controlled impedance PCB High Density PCB
Multi-Layer     PCB     (4-12    layers)	- HASL - PTH - Cu (Pre Flux    Coating) - Au - Carbon	11,000 §³	Note Book PC, L.C.D., DVD-Rom, Handy Phone, Fax, Printer Board, CT-11, Burnin Board, FDD, HDD, SVR-Digital, Pager, Module, TFT-LCD, VCO, Electroless Au Pth Board,	B.V.H. I.V.H. Build up PCB

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- BGA (Ball Grid Array), VCO -
    BGA technology has been developed in accordance with the    changing of semi conductor's package type from QPF to BGA. 
        Base material      ; B.T. Resin, polyimide
       Layer                ; 2~6 Layers
       Thickness           ; 0.2~0.8
       Conductor width  ; EX. Layer;0.12, INNER Layer ; 0.12
       Conductor space  ; 0.06 mm
       Surface treatment ; Electro gold plating
       Hole dia.              ; Ø 0.3

- I.V.H. (Interstitial Via Hole)
  - These PCB'S are used for the electronic appliances where high      density wring and portability are its objective, via hole PCB'S
     can significantly reduce the board surface area.
  - Video Camera, PCS, Note Book PC, Mobile Phone
       Base material      ; FR-4
       Layer                ; 6~8 Layers
       Thickness           ; 0.8~1.0
       Conductor width  ; EX. Layer;0.12, INNER Layer ; 0.12
       Conductor space  ; 0.10
       Surface treatment ; Electro gold plating
       Hole dia.              ; Ø 0.3   

- 4 LINES / 70 MIL DESIGN
    The benefits of increasing number of lines between 70 mil     centers are apparent.  12 layer PCB'S can be reduced to
    4 layers using this Concept.
   - PCS, Notebook PC, Small Electronic Appliances, HDD, Video
       Base material      ; FR-4
       Layer                ; 4~12 Layers
       Thickness           ; 0.4~1.6
       Conductor width  ; EX. Layer;0.10, INNER Layer ; 0.10
       Conductor space  ; 0.1
       Surface treatment ; HASL, FLUX, Gold plating
       Hole dia.              ; Ø 0.3

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