Double Side and Multi-layer PCB Board |
Facility-2 ; - |
-< AUTOMATIC PATTERN IMAGE SYSTEM >- |
The automatic laminator and exposure
system are installed for the use of
dry film construction method which
is required for the formin of high
density circuit, and also it has
prerfect apparatus for normal
tempreature and normal humidity. |
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-< PHOTORESIST SOLDER MASK PRINTING >- |
The exposure m/c, auto-printing
m/c, and developing m/c are installed
on it which is necessary for the
photoresist solder mask printing
system to maintain high quality
of the products. |

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-< QUALITY ASSURANCE >- |
The inferiority of soldering and long
term preservation ability are
improved considerably in its
surface treatment problems ;-
- Small sized multi pins' IC type
- Maintain ubiformity of the surface
- Stronger against the reflow
temperature than the water-soluble flux |

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-< T.Q.C. ACTIVITY >- |
Nine section teams are operating
for the quality control process
improvement, and also meetings have
been held for the quality improvement. |

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Home (printed-circuit-board)
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